FAB-9 - PCB Fabrication, PCB Assembly, and Mechanical Box Build.

2.1 Material Table

2.2 Warpage per Inch, IPC TM 650 (examples: 2.6.1 - 2.6.4)

2.3 Copper Foil Outer see 1.3

2.4 Board Thickness: Min/Max

2.5 Thickness Finished Tolerance

2.6 How Many Layers Fit in a Stack Thickness

2.7 Minimum Dielectric Thickness to Prevent Lam Void

2.8 HDI Constructions, examples

2.9 Minimum Dielectric Thickness for 240VDC