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Fab-9 Vietnam Ltd.

Fab-9 Corp. -US Head Quarter
1630 Oakland Road
STE A105
San Jose CA 95131
PH: 408-436-8896
Fax:408-436-8851
Email: This e-mail address is being protected from spam bots, you need JavaScript enabled to view it or This e-mail address is being protected from spam bots, you need JavaScript enabled to view it
 
Fab-9 corp. -Manufacturing facility
1B Street
Dong An Industrial Park
Binh Duong Province, Viet Nam
PH: 84-650-3783423 /24/25
Fax: 84-650-3783426
Email: This e-mail address is being protected from spam bots, you need JavaScript enabled to view it


 
 
Technology Print E-mail
FAB-9 Capabilities Chart

CATEGORY

STANDARD

SPECIAL

Board Thickness
Minimum.020" (upto 6 layers).013" (upto 4 layers)
Maximum.125".200"
Panel / Board Dimensions
Minimum Panel Dimensions18" x 24"n/a
Maximum Panel Dimensions18" x 24"n/a
Maximum Board Dimensions16" x 22"n/a
Minimum Lines & Spaces
Lines – Internal (0.5oz based copper thickness)0.004” (1/2 oz cu)0.003" (1/2 oz cu)
Lines – External (0.5oz based copper thickness)0.004” (1/2 oz cu)0.003" (1/2 oz cu)
Spaces – Internal (0.5oz based copper thickness)0.004” (1/2 oz cu)0.003" (1/2 oz cu)
Spaces – External (0.5oz based copper thickness)0.004” (1/2 oz cu)0.003" (1/2 oz cu)
Layer Count
Maximum Layer Count – rigid2430
Maximum Layer Count – flex2
4
Maximum Layer Count – rigid/ flex46
* Structure related  
Based Copper Thickness Capability
0.25 ozn/ayes
0.5 ozyesn/a
1.0 ozyesn/a
2.0 ozyesn/a
3.0 ozn/ayes
4.0 ozn/ayes
Annular Ring (pad to drill difference)
Internal Layers2.5 mil2.0 mil
External Layers2.5 mil 2.0 mil
Minimum Hole to Metal7.0 mil<7.0 mil
Drilling Capability
Minimum Drilled Hole10.0 mil6.0 mil
Hole Location Accuracy1 miln/a
Image to Hole Location Accuracy1 miln/a
Drill to Metal Minimum Spacing7 mil5 mil
Aspect Ratio8:110:1
Micro-via Drilling Aspect Ration/an/a
Micro-via Drilling Diametern/an/a
Micro-via Stop Pad Diametern/an/a
Dielectric Thickness of Micro-via Layern/an/a
Solder Mask
Minimum Solder Mask Clearance SMD Pads2 mil2 mil
Minimum Solder Mask Dam Between SMD Pads3.0 mil2.0 mil
Minimum Solder Mask Thicknessn/an/a
Plating Capability
Average Copper Plating1 miln/a
Minimum Copper Plating1 miln/a
Minimum Tin/Lead as Plated (if applicable)n/an/a
Nickel Thickness150 uinchn/a
Gold Edge Connector Thickness50 uinchn/a
Selective Electrolytic Gold Platingsoft gold upto 15uinchn/a
OSP Thicknessn/an/a
HAL Thicknessn/an/a
Immersion Gold Thicknessn/an/a
Immersion Tin Thicknessn/an/a
Immersion Silvern/an/a
Machining
Routing Tolerance3.0 mil2.0 mil
Hole to Edge Location10.0 mil7.0 mil
Metal to Edge Minimum 7 mil5 mil
V-Groove Angles Capabilityyesn/a
Electrical Test
Single Ended Impedance10%5%
Differential Impedance10%5%
Test Voltageyesn/a
Max Isolation Resistanceyesn/a
Min Continuity Resistanceyesn/a
 
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